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CMOS, Low Voltage Serially-Controlled, Octal SPST Switches ADG714/ADG715
FUNCTIONAL BLOCK DIAGRAMS
ADG714
S1 S2 S3 S4 S5 S6 S7 S8 INPUT SHIFT REGISTER D1 D2 D3 D4 D5 D6 D7 D8 DOUT S1 S2 S3 S4 S5 S6 S7 S8 INTERFACE LOGIC RESET SCLK DIN SYNC RESET SDA SCL A0 A1
FEATURES ADG714 SPITM/QSPITM/MICROWIRETM-Compatible Interface ADG715 I2CTM-Compatible Interface 2.7 V to 5.5 V Single Supply 3 V Dual Supply 2.5 On Resistance 0.6 On Resistance Flatness 100 pA Leakage Currents Octal SPST Power-On Reset Fast Switching Times TTL/CMOS-Compatible Small TSSOP Package APPLICATIONS Data Acquisition Systems Communication Systems Relay Replacement Audio and Video Switching
ADG715
D1 D2 D3 D4 D5 D6 D7 D8
GENERAL DESCRIPTION
The ADG714/ADG715 are CMOS, octal SPST (single-pole, single-throw) switches controlled via either a two- or 3-wire serial interface. On resistance is closely matched between switches and very flat over the full signal range. Each switch conducts equally well in both directions and the input signal range extends to the supplies. Data is written to these devices in the form of 8 bits, each bit corresponding to one channel. The ADG714 utilizes a 3-wire serial interface that is compatible with SPI , QSPI and MICROWIRE and most DSP interface standards. The output of the shift register DOUT enables a number of these parts to be daisy chained. The ADG715 utilizes a 2-wire serial interface that is compatible with the I2C interface standard. The ADG715 has four hard wired addresses, selectable from two external address pins (A0 and A1). This allows the 2 LSBs of the 7-bit slave address to be set by the user. A maximum of four of these devices may be connected to the bus.
On power-up of these devices, all switches are in the OFF condition, and the internal registers contain all zeros. Low power consumption and operating supply range of 2.7 V to 5.5 V make this part ideal for many applications. These parts may also be supplied from a dual 3 V supply. The ADG714 and ADG715 are available in a small 24-lead TSSOP package.
PRODUCT HIGHLIGHTS
1. 2-3-Wire Serial Interface. 2. Single/Dual Supply Operation. The ADG714 and ADG715 are fully specified and guaranteed with 3 V, 5 V, and 3 V supply rails. 3. Low On Resistance, typically 2.5 . 4. Low Leakage. 5. Power-On Reset. 6. Small 24-lead TSSOP package.
I2C is a trademark of Philips Corporation. SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corporation.
REV. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2000
ADG714/ADG715-SPECIFICATIONS1 (V
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (R FLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage I D (OFF) Channel ON Leakage I D, IS (ON) DIGITAL INPUTS (SCLK, DIN, SYNC, A0, A1) Input High Voltage, V INH Input Low Voltage, VINL Input Current, IINL or IINH CIN, Digital Input Capacitance2 DIGITAL OUTPUT ADG714 DOUT Output Low Voltage COUT Digital Output Capacitance DIGITAL INPUTS (SCL, SDA) 2 Input High Voltage, V INH Input Low Voltage, VINL IIN, Input Leakage Current VHYST, Input Hysteresis CIN, Input Capacitance LOGIC OUTPUT (SDA) 2 VOL, Output Low Voltage DYNAMIC CHARACTERISTICS 2 tON ADG714 tON ADG715 tOFF ADG714 tOFF ADG715 Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel-to-Channel Crosstalk -3 dB Bandwidth CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
2
DD
=5V
10%, VSS = 0 V, GND = 0 V unless otherwise noted)
B Version -40 C +25 C to +85 C
Unit
Test Conditions/Comments
2.5 4.5 0.6
0 V to VDD V typ 5 max 0.4 typ 0.8 max typ 1.2 max 0.3 0.3 0.3 2.4 0.8 nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ max pF typ V min V max V min V max A typ A max V min pF typ V max V max ns typ ns max ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ dB typ dB typ MHz typ pF typ pF typ pF typ A typ A max
VS = 0 V to VDD, IS = 10 mA VS = 0 V to VDD , IS = 10 mA VS = 0 V to VDD, IS = 10 mA VDD = 5.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V VD = 4.5 V/1 V, VS = 1 V/4.5 V VD = VS = 1 V, or 4.5 V
0.01 0.1 0.01 0.1 0.01 0.1
0.005 3
0.1
VIN = VINL or VINH
0.4 4 0.7 VDD VDD + 0.3 -0.3 0.3 VDD 0.005 0.05 VDD 6 0.4 0.6 20 32 95 140 8 15 85 130 8 3 -60 -80 -70 -90 155 11 11 22 10 20 1 1
ISINK = 6 mA
VIN = 0 V to VDD
ISINK = 3 mA ISINK = 6 mA VS = 3 V, RL = 300 , CL = 35 pF VS = 3 V, RL = 300 , CL = 35 pF VS = 3 V, RL = 300 , CL = 35 pF VS = 3 V, RL = 300 , CL = 35 pF VS = 3 V, RL = 300 , CL = 35 pF VS = 2 V, RS = 0 , CL = 1 nF RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF
VDD = 5.5 V Digital Inputs = 0 V or 5.5 V
-2-
REV. 0
SPECIFICATIONS
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON)
1
ADG714/ADG715
(VDD = 3 V 10%, VSS = 0 V, GND = 0 V unless otherwise noted)
B Version -40 C +25 C to +85 C
Unit
Test Conditions/Comments
6 11
On-Resistance Match Between Channels (RON) On-Resistance Flatness (R FLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage I S (OFF) Drain OFF Leakage I D (OFF) Channel ON Leakage I D, IS (ON) DIGITAL INPUTS (SCLK, DIN, SYNC, A0, A1) Input High Voltage, V INH Input Low Voltage, VINL Input Current, IINL or IINH CIN, Digital Input Capacitance2 DIGITAL OUTPUT ADG714 DOUT 2 Output Low Voltage COUT Digital Output Capacitance DIGITAL INPUTS (SCL, SDA) 2 Input High Voltage, V INH Input Low Voltage, VINL IIN, Input Leakage Current VHYST, Input Hysteresis CIN, Input Capacitance LOGIC OUTPUT (SDA) 2 VOL, Output Low Voltage DYNAMIC CHARACTERISTICS 2 tON ADG714 tON ADG715 tOFF ADG714 tOFF ADG715 Break-Before-Make Time Delay, t D Charge Injection Off Isolation Channel-to-Channel Crosstalk -3 dB Bandwidth CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
0 V to VDD V typ 12 max 0.4 typ 1.2 max 3.5 typ 0.3 0.3 0.3 2.0 0.4 nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ max pF typ V min V max V min V max A typ A max V min pF typ V max V max ns typ ns max ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ dB typ dB typ MHz typ pF typ pF typ pF typ A typ A max
VS = 0 V to VDD, IS = 10 mA VS = 0 V to VDD , IS = 10 mA VS = 0 V to VDD, IS = 10 mA VDD = 3.3 V VS = 3 V/1 V, VD = 1 V/3 V VS = 1 V/3 V, VD = 3 V/1 V VS = VD = 1 V, or 3 V
0.01 0.1 0.01 0.1 0.01 0.1
0.005 3
0.1
VIN = VINL or VINH
0.4 4 0.7 VDD VDD + 0.3 -0.3 0.3 VDD 0.005 0.05 VDD 6 0.4 0.6 35 65 130 200 11 20 115 180 8 2 -60 -80 -70 -90 155 11 11 22 10 20 1 1
ISINK = 6 mA
VIN = 0 V to VDD
ISINK = 3 mA ISINK = 6 mA VS = 2 V, RL = 300 , CL = 35 pF VS = 2 V, RL = 300 , CL = 35 pF VS = 2 V, RL = 300 , CL = 35 pF VS = 2 V, RL = 300 , CL = 35 pF VS = 2 V, RL = 300 , CL = 35 pF VS = 1.5 V, RS = 0 , CL = 1 nF RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF
VDD = 3.3 V Digital Inputs = 0 V or 3.3 V
REV. 0
-3-
DUAL SUPPLY
ADG714/ADG715-SPECIFICATIONS 1
(VDD = +3 V 10%, VSS = 3 V
GND = 0 V unless otherwise noted)
Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH CIN, Digital Input Capacitance2 DIGITAL OUTPUT ADG714 DOUT2 Output Low Voltage COUT Digital Output Capacitance DIGITAL INPUTS (SCL, SDA)2 Input High Voltage, VINH Input Low Voltage, VINL IIN, Input Leakage Current VHYST, Input Hysteresis CIN, Input Capacitance LOGIC OUTPUT (SDA)2 VOL, Output Low Voltage DYNAMIC CHARACTERISTICS2 tON ADG714 tON ADG715 tOFF ADG714 tOFF ADG715 Break-Before-Make Time Delay, tD Charge Injection Off Isolation Channel-to-Channel Crosstalk -3 dB Bandwidth CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD ISS
NOTES 1 Temperature range is as follows: B Version: -40C to +85C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
B Version -40 C +25 C to +85 C
Unit
Test Conditions/Comments
2.5 4.5 0.6 0.01 0.1 0.01 0.1 0.01 0.1
VSS to VDD V typ 5 max 0.4 typ 0.8 max typ 1 max 0.3 0.3 0.3 2.0 0.4 nA typ nA max nA typ nA max nA typ nA max V min V max A typ A max pF typ max pF typ V min V max V min V max A typ A max V min pF typ V max V max ns typ ns max ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ dB typ dB typ MHz typ pF typ pF typ pF typ A typ A max A typ A max
VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA VS = VSS to VDD, IDS = 10 mA VDD = +3.3 V, VSS = -3.3 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V VS = +2.25 V/-1.25 V, VD = -1.25 V/+2.25 V VS = VD = +2.25 V/-1.25 V
0.005 3
0.1
VIN = VINL or VINH
0.4
ISINK = 6 mA
4
0.7 VDD VDD + 0.3 -0.3 0.3 VDD 0.005 0.05 VDD 6 0.4 0.6 20 32 133 200 8 18 124 190 8 3 -60 -80 -70 -90 155 11 11 22 15 25 15 25 1 1
VIN = 0 V to VDD
ISINK = 3 mA ISINK = 6 mA VS = 1.5 V, RL = 300 , CL = 35 pF VS = 1.5 V, RL = 300 , CL = 35 pF VS = 1.5 V, RL = 300 , CL = 35 pF VS = 1.5 V, RL = 300 , CL = 35 pF VS = 1.5 V, RL = 300 , CL = 35 pF VS = 0 V, RS = 0 , CL = 1 nF RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF, f = 10 MHz RL = 50 , CL = 5 pF, f = 1 MHz RL = 50 , CL = 5 pF
VDD = +3.3 V, VSS = -3.3 V Digital Inputs = 0 V or 3.3 V
-4-
REV. 0
ADG714/ADG715 ADG714 TIMING CHARACTERISTICS1, 2 (V
Parameter fSCLK t1 t2 t3 t4 t5 t6 t7 t8 t9 3 Limit at TMIN, TMAX 30 33 13 13 0 5 4.5 0 33 20
DD
= 2.7 V to 5.5 V. All specifications -40 C to +85 C unless otherwise noted.)
Conditions/Comments SCLK Cycle Frequency SCLK Cycle Time SCLK High Time SCLK Low Time SYNC to SCLK Rising Edge Setup Time Data Setup Time Data Hold Time SCLK Falling Edge to SYNC Rising Edge Minimum SYNC High Time SCLK Rising Edge to DOUT Valid
Unit MHz max ns min ns min ns min ns min ns min ns min ns min ns min ns min
NOTES 1 See Figure 1. 2 All input signals are specified with tr = tf = 5 ns (10% to 90% of V DD) and timed from a voltage level of (V IL + VIH)/2. 3 CL = 20 pF, RL = 1 k. Specifications subject to change without notice.
t1
SCLK
t8 t4
SYNC
t2
t3 t7
t6 t5
DIN DB7 DB0
t9
DOUT DB71 DB61 DB21 DB11 DB01
NOTE 1DATA FROM PREVIOUS WRITE CYCLE
Figure 1. 3-Wire Serial Interface Timing Diagram
REV. 0
-5-
ADG714/ADG715 ADG715 TIMING CHARACTERISTICS1 (V
Parameter fSCL t1 t2 t3 t4 t5 t6 2 t7 t8 t9 t10 t11 t11 Cb tSP4 Limit at TMIN, TMAX 400 2.5 0.6 1.3 0.6 100 0.9 0 0.6 0.6 1.3 300 20 + 0.1Cb3 250 300 20 + 0.1Cb3 400 50 Unit kHz max s min s min s min s min ns min s max s min s min s min s min ns max ns min ns max ns max ns min pF max ns max
DD
= 2.7 V to 5.5 V. All specifications -40 C to +85 C unless otherwise noted.)
Conditions/Comments SCL Clock Frequency SCL Cycle Time tHIGH, SCL High Time tLOW, SCL Low Time tHD, STA, Start/Repeated Start Condition Hold Time tSU, DAT, Data Setup Time tHD, DAT, Data Hold Time tSU, STA, Setup Time for Repeated Start tSU, STO, Stop Condition Setup Time tBUF, Bus Free Time Between a STOP Condition and a Start Condition tR, Rise Time of both SCL and SDA when Receiving tF, Fall Time of SDA When Receiving tF, Fall Time of SDA when Transmitting Capacitive Load for Each Bus Line Pulsewidth of Spike Suppressed
NOTES 1 See Figure 2. 2 A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the V IH min of the SCL signal) in order to bridge the undefined region of SCL's falling edge. 3 Cb is the total capacitance of one bus line in pF. t R and t F measured between 0.3 V DD and 0.7 VDD. 4 Input filtering on both the SCL and SDA inputs suppress noise spikes that are less than 50 ns. Specifications subject to change without notice.
SDA
t9
t3
t10
t11
t4
SCL
t4
START CONDITION
t6
t2
t5
t7
REPEATED START CONDITION
t1
t8
STOP CONDITION
Figure 2. 2-Wire Serial Interface Timing Diagram
-6-
REV. 0
ADG714/ADG715
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -3.5 V Analog Inputs2 . . . . . . . . . . . . . . . VSS - 0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Digital Inputs2 . . . . . . . . . . . . . . . . . . . -0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . .100 mA (Pulsed at 1 ms, 10% Duty Cycle Max) Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 30 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C
TSSOP Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 128C/W JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG714/ADG715 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. ORDERING GUIDE
WARNING!
ESD SENSITIVE DEVICE
Model ADG714BRU ADG715BRU
Temperature Range -40C to +85C -40C to +85C
Interface SPI/QSPI/MICROWIRE I2C-Compatible
Package Description TSSOP TSSOP
Package Option RU-24 RU-24
PIN CONFIGURATIONS 24-Lead TSSOP
SCLK VDD DIN GND S1 D1 S2 D2 S3
1 2 3 4 5 6
24 SYNC 23 RESET 22 DOUT 21 VSS
SCL VDD SDA GND S1 D1 S2 D2 S3
1 2 3 4 5 6
24 A0 23 RESET 22 A1 21 VSS
ADG714
20 S8
ADG715
20 S8
TOP VIEW 19 D8 (Not to Scale) 18 S7 7
8 9 17 D7 16 S6 15 D6 14 S5 13 D5
TOP VIEW 19 D8 (Not to Scale) 18 S7 7
8 9 17 D7 16 S6 15 D6 14 S5 13 D5
D3 10 S4 11 D4 12
D3 10 S4 11 D4 12
REV. 0
-7-
ADG714/ADG715
ADG714 PIN FUNCTION DESCRIPTIONS
Pin No. 1 2 3 4 5, 7, 9, 11, 14, 16, 18, 20 6, 8, 10, 12, 13, 15, 17, 19 21 22
Mnemonic SCLK VDD DIN GND Sx Dx VSS DOUT
Description Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. These devices can accommodate serial input rates of up to 30 MHz. Positive Analog Supply Voltage. Serial Data Input. Data is clocked into the 8-bit input register on the falling edge of the serial clock input. Ground Reference. Source. May be an input or output. Drain. May be an input or output. Negative Analog Supply Voltage. For single supply operation this should be tied to GND. Serial Data Output. This allows a number a parts to be daisy chained. Data is clocked out of the input shift register on the rising edge of SCLK. DOUT is an open-drain output that should be pulled to the supply with an external pull-up resistor. Active Low Control Input. Clears the input register and turns all switches to the OFF condition. Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it powers on the SCLK and DIN buffers and the input shift register is enabled. Data is transferred on the falling edges of the following clocks. Taking SYNC high updates the switches.
ADG715 PIN FUNCTION DESCRIPTIONS
23 24
RESET SYNC
Pin No. 1 2 3
Mnemonic SCL VDD SDA
Description Serial Clock Line. This is used in conjunction with the SDA line to clock data into the 8-bit input shift register. Clock rates of up to 400 kbit/s can be accommodated with this 2-wire serial interface. Positive Analog Supply Voltage. Serial Data Line. This is used in conjunction with the SCL line to clock data into the 8-bit input shift register during the write cycle and used to readback one byte of data during the read cycle. It is a bidirectional open-drain data line which should be pulled to the supply with an external pullup resistor. Ground Reference. Source. May be an input or output. Drain. May be an input or output. Negative Analog Supply Voltage. For single supply operation this should be tied to GND. Address Input. Sets the second least significant bit of the 7-bit slave address. Active Low Control Input. Clears the input register and turns all switches to the OFF condition. Address Input. Sets the least significant bit of the 7-bit slave address.
4 5, 7, 9, 11, 14, 16, 18, 20 6, 8, 10, 12, 13, 15, 17, 19 21 22 23 24
GND Sx Dx VSS A1 RESET A0
-8-
REV. 0
ADG714/ADG715
TERMINOLOGY
VDD VSS
IDD ISS GND S D RON RON RFLAT(ON)
Most positive power supply potential. Most negative power supply in a dual supply application. In single supply applications, this should be tied to ground. Positive Supply Current. Negative Supply Current. Ground (0 V) Reference Source Terminal. May be an input or output. Drain Terminal. May be an input or output. Ohmic resistance between D and S. On-resistance match between any two channels, i.e., RON max-RON min. Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal range. Source leakage current with the switch "OFF." Drain leakage current with the switch "OFF." Channel leakage current with the switch "ON." Analog voltage on terminals D and S. "OFF" Switch Source Capacitance. Measured with reference to ground. "OFF" Switch Drain Capacitance. Measured with reference to ground.
IS (OFF) ID (OFF) ID, IS (ON) VD (VS) CS (OFF) CD (OFF)
"ON" Switch Capacitance. Measured with reference to ground. CIN Digital Input Capacitance. tON Delay time between loading new data to the shift register and selected switches switching on. tOFF Delay time between loading new data to the shift register and selected switches switching off. Off Isolation A measure of unwanted signal coupling through an "OFF" switch. Crosstalk A measure of unwanted signal which is coupled through from one channel to another as a result of parasitic capacitance. Charge A measure of the glitch impulse transferred Injection from the digital input to the analog output during switching. Bandwidth The frequency at which the output is attenuated by -3 dBs. On Response The frequency response of the "ON" switch. Insertion Loss The loss due to the ON resistance of the switch. Insertion Loss = 20 log10 (VOUT with switch/ VOUT without switch. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL(IINH) Input current of the digital input. IDD Positive Supply Current.
CD, CS (ON)
REV. 0
-9-
ADG714/ADG715 -Typical Performance Characteristics
8 7 6 TA = 25 C VSS = GND VDD = 2.7V
8 VDD = 3V VSS = GND
7
ON RESISTANCE -
5 VDD = 3.3V 4 VDD = 4.5V 3 2 VDD = 5.5V
ON RESISTANCE -
6 +85 C 5 +25 C
4 -40 C 3
1 0 0 1 2 3 4 VD, VS, DRAIN OR SOURCE VOLTAGE - V 5
2 0 0.5 1.0 1.5 2.0 2.5 3.0 VD OR VS DRAIN OR SOURCE VOLTAGE - V
Figure 3. On Resistance as a Function of VD (VS) Single Supply
Figure 6. On Resistance as a Function of VD (VS) for Different Temperatures; VDD = 5 V
8 TA = 25 C 7 6
ON RESISTANCE -
ON RESISTANCE -
8 7 6 5 4 +25 C 3 2 +85 C VDD = +3.0V VSS = -3.0V
5 4 3 2 1 VDD = +3.0V VSS = -3.0V VDD = +3.3V VSS = -3.3V VDD = +2.7V VSS = -2.7V
1 0 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5
-40 C
0 -3.3 -2.7 -2.1 -1.5 -0.9 -0.3 0.3 0.9 1.5 2.1 2.7 VD OR VS DRAIN OR SOURCE VOLTAGE - V
3.3
0
0.5 1.0
1.5
2.0
2.5 3.0
VD OR VS - DRAIN OR SOURCE VOLTAGE - V
Figure 4. On Resistance as a Function of VD (VS); Dual Supply
Figure 7. On Resistance as a Function of VD (VS) for Different Temperatures; Dual Supply
8 7 6
ON RESISTANCE -
0.04
VDD = 5V VSS = GND
0.02 CURRENT - nA
VDD = 5V VSS = GND TA = 25 C
5 4 +85 C 3 2 -40 C 1 0 0 1 2 3 4 VD OR VS DRAIN OR SOURCE VOLTAGE - V 5 +25 C
I S , I D (ON)
0
I D (OFF) -0.02 I S (OFF)
-0.04 0 1 2 3 4 5 VD OR VS - Volts
Figure 5. On Resistance as a Function of VD (VS) for Different Temperatures; VDD = 3 V
Figure 8. Leakage Currents as a Function of VD (VS)
-10-
REV. 0
ADG714/ADG715
0.04 VDD = 3V VSS = GND TA = 25 C 0.02 CURRENT - nA 0.05 I S , I D (ON) 0.1 VDD = 3V VSS = GND VD = 3V/1V VS = 1V/3V I D , I S (ON) 0 I S (OFF) -0.05 I D (OFF)
0 I D (OFF) -0.02 I S (OFF)
-0.04 0 0.5 1 1.5 VOLTAGE - V 2 2.5 3
CURRENT - nA
-0.1 10
20
30
50 60 40 TEMPERATURE - C
70
80
Figure 9. Leakage Currents as a Function of VD (VS)
Figure 12. Leakage Currents as a Function of Temperature
0.04 VDD = +3V VSS = -3V TA = 25 C 0.02 ATTENUATION - dB
0 VDD = 5V TA = 25 C -20
CURRENT - nA
I D (OFF) I S (OFF) 0
-40
-60
I S , I D (ON) -0.02
-80
-100
-0.04
-3
-2
-1
0 VOLTAGE - V
1
2
3
-120 30k
100k
1M FREQUENCY - Hz
10M
100M
Figure 10. Leakage Currents as a Function of VD (VS) Dual Supply
Figure 13. Off Isolation vs. Frequency
0.1 VDD = +3V VSS = -3V VD = +2.25V/-1.25V VS = -1.25V/+2.25V VDD = +5V VSS = GND VD = 4.5V/1V VS = 1V/4.5V I S , I D (ON)
0 -2
0.05
ATTENUATION - dB
-4
CURRENT - nA
-6
0 I D (OFF)
I S (OFF)
-8
-10
-0.05
-12
-0.1 10
20
30
40 50 60 TEMPERATURE - C
70
80
-14 30k
100k
1M 10M FREQUENCY - Hz
100M
300M
Figure 11. Leakage Currents as Function of Temperature
Figure 14. On Response vs. Frequency
REV. 0
-11-
ADG714/ADG715
-40 VDD = 5V TA = 25 C -50
GENERAL DESCRIPTION
ATTENUATION - dB
-60
-70
The ADG714 and ADG715 are serially controlled, octal SPST switches, controlled by either a 2- or 3-wire interface. Each bit of the 8-bit serial word corresponds to one switch of the part. A Logic 1 in the particular bit position turns on the switch, while a Logic 0 turns the switch off. Because each switch is independently controlled by an individual bit, this provides the option of having any, all, or none of the switches ON. When changing the switch conditions, a new 8-bit word is written to the input shift register. Some of the bits may be the same as the previous write cycle, as the user may not wish to change the state of some switches. In order to minimize glitches on the output of these switches, the part cleverly compares the state of switches from the previous write cycle. If the switch is already in the ON condition, and is required to stay ON, there will be minimal glitches on the output of the switch.
POWER-ON RESET
-80
-90
-100 30k
100k
1M FREQUENCY - Hz
10M
100M
Figure 15. Crosstalk vs. Frequency
10 TA = 25 C 5 VDD = +3.3V VSS = GND
On power-up of the device, all switches will be in the OFF condition and the internal shift register is filled with zeros and will remain so until a valid write takes place.
SERIAL INTERFACE 3-Wire Serial Interface
0
QINJ - pC
VDD = +3.0V VSS = -3.0V -5
VDD = +5V VSS = GND
-10
The ADG714 has a 3-wire serial interface (SYNC, SCLK, and DIN), that is compatible with SPI, QSPI, MICROWIRE interface standards and most DSPs. Figure 1 shows the timing diagram of a typical write sequence. Data is written to the 8-bit shift register via DIN under the control of the SYNC and SCLK signals. Data may be written to the shift register in more or less than eight bits. In each case the shift register retains the last eight bits that were written. When SYNC goes low, the input shift register is enabled. Data from DIN is clocked into the shift register on the falling edge of SCLK. Each bit of the 8-bit word corresponds to one of the eight switches. Figure 18 shows the contents of the input shift register. Data appears on the DOUT pin on the rising edge of SCLK suitable for daisy chaining, delayed of course by eight bits. When all eight bits have been written into the shift register, the SYNC line is brought high again. The switches are updated with the new configuration and the input shift register is disabled. With SYNC held high, the input shift register is disabled, so further data or noise on the DIN line will have no effect on the shift register.
DB7 (MSB) DB0 (LSB) S6 S5 S4 S3 S2 S1
-15
-20 -3
-2
-1
0
1 2 VOLTAGE - V
3
4
5
Figure 16. Charge Injection vs. Source/Drain Voltage
45 VSS = GND 40 35 30 TO N , V DD = 3V
TIME - ns
25 20 15 10 5 0 10
TO N , V DD = 5V
TOFF , V DD = 3V
S8
S7
DATA BITS
TO F F , V DD = 5V 20 30 40 50 60 TEMPERATURE - C 70 80
Figure 18. Input Shift Register Contents
SERIAL INTERFACE 2-Wire Serial Interface
Figure 17. TON /TOFF Times vs. Temperature for ADG714
The ADG715 is controlled via an I2C-compatible serial bus. This device is connected to the bus as a slave device (no clock is generated by the switch). The ADG715 has a 7-bit slave address. The five MSBs are 10010 and the two LSBs are determined by the state of the A0 and A1 pins.
-12-
REV. 0
ADG714/ADG715
The 2-wire serial bus protocol operates as follows: 1. The master initiates data transfer by establishing a START condition, which is when a high-to-low transition on the SDA line occurs while SCL is high. The following byte is the address byte that consists of the 7-bit slave address followed by a R/W bit (this bit determines whether data will be read from or written to the slave device). The slave whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse (this is termed the acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to or read from its serial register. If the R/W bit is high, the master will read from the slave device. However, if the R/W bit is low, the master will write to the slave device. 2. Data is transmitted over the serial bus in sequences of nine clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of SCL and remain stable during the high period of SCL. 3. When all data bits have been read or written, a STOP condition is established by the master. A STOP condition is defined as a low-to-high transition on the SDA line while SCL is high. In write mode, the master will pull the SDA line high during the tenth clock pulse to establish a STOP condition. In read mode, the master will issue a no acknowledge for the ninth clock pulse (i.e., the SDA line remains high). The master will then bring the SDA line low before the tenth clock pulse and then high during the tenth clock pulse to establish a STOP condition. See Figure 19 for a graphical explanation of the serial interface. A repeated write function gives the user flexibility to update the matrix switch a number of times after addressing the part only once. During the write cycle, each data byte will update the configuration of the switches. For example, after the matrix switch has acknowledged its address byte, and received one data byte, the switches will update after the data byte; if another data byte is written to the matrix switch while it is still the addressed slave device, this data byte will also cause a switch configuration update. Repeat read of the matrix switch is also allowed.
Input Shift Register
The input shift register is eight bits wide. Figure 18 illustrates the contents of the input shift register. Data is loaded into the device as an 8-bit word under the control of a serial clock input, SCL. The timing diagram for this operation is shown in Figure 2. The 8-bit word consists of eight data bits, each controlling one switch. MSB (Bit 7) is loaded first.
Write Operation
When writing to the ADG715, the user must begin with an address byte and R/W bit, after which the switch will acknowledge that it is prepared to receive data by pulling SDA low. This address byte is followed by the 8-bit word. The write operation for the switch is shown in the Figure 19 below.
READ Operation
When reading data back from the ADG715, the user must begin with an address byte and R/W bit, after which the switch will acknowledge that it is prepared to transmit data by pulling SDA low. The readback operation is a single byte that consists of the eight data bits in the input register. The read operation for the part is shown in Figure 20.
SCL
SDA START COND BY MASTER
1
0
0
1
0
A1
A0
R/W ACK BY ADG715
S8
S7
S6
S5
S4 DATA BYTE
S3
S2
S1 ACK BY ADG715 STOP COND BY MASTER
ADDRESS BYTE
Figure 19. ADG715 Write Sequence
SCL
SDA START COND BY MASTER
1
0
0
1
0
A1
A0
R/W ACK BY ADG715
S8
S7
S6
S5
S4
S3
S2
S1 NO ACK BY MASTER STOP COND BY MASTER
ADDRESS BYTE
DATA BYTE
Figure 20. ADG715 Readback Sequence
REV. 0
-13-
ADG714/ADG715
APPLICATIONS Multiple Devices On One Bus Power Supply Sequencing
Figure 21 shows four ADG715 devices on the same serial bus. Each has a different slave address since the state of their A0 and A1 pins is different. This allows each switch to be written to or read from independently.
Daisy-Chaining Multiple ADG714s
A number of ADG714 switches may be daisy-chained simply by using the DOUT pin. Figure 22 shows a typical implementation. The SYNC pin of all three parts in the example are tied together. When SYNC is brought low, the input shift registers of all parts are enabled, data is written to the parts via DIN, and clocked through the shift registers. When the transfer is complete, SYNC is brought high and all switches are updated simultaneously. Further shift registers may be added in series.
VDD RP MASTER RP
When using CMOS devices, care must be taken to ensure correct power-supply sequencing. Incorrect power-supply sequencing can result in the device being subjected to stresses beyond those maximum ratings listed in the data sheet. Digital and analog inputs should always be applied after power supplies and ground. In dual supply applications, if digital or analog inputs may be applied to the device prior to the VDD and VSS supplies, the addition of a Schottky diode connected between VSS and GND will ensure that the device powers on correctly. For single supply operation, VSS should be tied to GND as close to the device as possible.
Decoding Multiple ADG714s Using an ADG739
The dual 4-channel ADG739 multiplexer can be used to multiplex a single chip select line in order to provide chip selects for up to
SDA SCL VDD SDA A1 A0 SCL SDA A1 A0 SCL VDD SDA A1 A0 SCL VDD SDA A1 A0 SCL
ADG715
ADG715
ADG715
ADG715
Figure 21. Multiple ADG715s On One Bus VDD R SCLK DIN SCLK SCLK VDD R SCLK VDD R
ADG714
DIN DOUT
ADG714
DIN DOUT
ADG714
DIN DOUT TO OTHER SERIAL DEVICES
SYNC
SYNC
SYNC
SYNC
Figure 22. Multiple ADG714 Devices in a Daisy-Chained Configuration
-14-
REV. 0
ADG714/ADG715
four devices on the SPI bus. Figure 23 illustrates the ADG739 and multiple ADG714s in such a typical configuration. All devices receive the same serial clock and serial data, but only one device will receive the SYNC signal at any one time. The ADG739 is a serially controlled device also. One bit programmable pin of the microcontroller is used to enable the ADG739 via SYNC2, while another bit programmable pin is used as the chip select for the other serial devices, SYNC1. Driving SYNC2 low enables changes to be made to the addressed serial devices. By bringing SYNC1 low, the selected serial device hanging from the SPI bus will be enabled and data will be clocked into its shift register on the falling edges of SCLK. The convenient design of the matrix switch allows for different combinations of the four serial devices to be addressed at any one time. If more devices need to be addressed via one chip select line, the ADG738 is an 8channel device and would allow further expansion of the chip select scheme. There may be some digital feedthrough from the digital input lines because SCLK and DIN are permanently connected to each device. Using a burst clock will minimize the effects of digital feedthrough on the analog channels.
ADG714
SYNC DIN SCLK
ADG714
VDD SYNC DIN
1/2 of ADG739
S1A DA S2A S3A S4A SCLK DIN SYNC FROM CONTROLLER OR DSP
SCLK
SYNC1
OTHER SPI SYNC DEVICE
DIN SCLK
SYNC2
OTHER SPI SYNC DEVICE
DIN SCLK
SCLK DIN
Figure 23. Addressing Multiple ADG714s Using an ADG739
REV. 0
-15-
ADG714/ADG715
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead TSSOP (RU-24)
0.311 (7.90) 0.303 (7.70)
24
13
0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25)
1 12
PIN 1 0.006 (0.15) 0.002 (0.05) 0.0433 (1.10) MAX
SEATING PLANE
0.0256 (0.65) 0.0118 (0.30) BSC 0.0075 (0.19)
0.0079 (0.20) 0.0035 (0.090)
8 0
0.028 (0.70) 0.020 (0.50)
-16-
REV. 0
PRINTED IN U.S.A.
C3768-2.5-4/00 (rev. 0) 00043


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